Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC
Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC

Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC

MOQ : 100 Pieces

Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC Specification

  • Usage
  • Electronic devices, complex wiring applications
  • Features
  • Flexible, ultra-thin, multi-layer, double-sided, shielded, customizable, lightweight
  • Output
  • Depends on circuit design
  • Thermal Conductivity
  • 0.12 - 0.4 W/mK (depending on materials)
  • Interface
  • Flexible solder pads, ZIF connectors, SMT compatible
  • Input
  • Depends on circuit design
  • Components
  • Polyimide base, copper foil, adhesive, protective covering, shielding layer
  • IP Rating
  • No official rating, but basic moisture resistance
  • Operating Temperature
  • -40C to +85C
  • Sensors Specification
  • None (custom design possible)
  • Product Type
  • Multi-layer flexible circuit board
  • Application
  • Consumer electronics, medical devices, automotive electronics, industrial equipment
  • Rated Voltage
  • Up to 50V
  • Supply Voltage
  • 12V, 24V, or specified per circuit design
  • Size
  • Customizable, standard and bespoke sizes available
  • Dimension (L*W*H)
  • Customized as per client requirements
  • Function
  • Flexible circuit interconnection for electronic PCBs, double-sided signal transmission with shielding
  • Color
  • Yellow/Amber (Polyimide base with copper traces)
  • Weight
  • Ultra-lightweight (varies by size and layer count)
  • Capacity
  • Supports high-density interconnects
  • Thickness
  • 0.08 mm - 0.2 mm (Ultra-thin)
  • Current Rating
  • Up to 2A (varies by trace width and thickness)
  • Frequency
  • High-frequency signal support up to GHz range
  • Adhesive Type
  • Epoxy/Polyimide adhesive options
  • Bending Radius
  • as low as 1mm (depending on design)
  • Base Material
  • Polyimide (PI)
  • Shielding Technique
  • Copper or conductive polymer layer
  • Peel Strength
  • >= 1.0N/mm
  • Max Trace Width/Spacing
  • 0.05mm/0.05mm (50m/50m)
  • RoHS Status
  • Compliant
  • Delivery Format
  • Panelized, single, or continuous roll
  • Insulation Resistance
  • >= 110^7 M
  • Test Standard
  • IPC-6013, RoHS compliant
  • Copper Thickness
  • 1/3oz to 2oz (12-70m)
  • Surface Finish
  • OSP, ENIG, HASL, Immersion Gold, etc.
  • Layer Count
  • 2-10 layers (customizable)
  • Flame Retardant Rating
  • UL 94V-0 compliant
  • Halogen Free
  • Available per request
 

Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC Trade Information

  • Minimum Order Quantity
  • 100 Pieces
  • Supply Ability
  • 1000 Pieces Per Month
  • Delivery Time
  • 7 Days
 

About Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC



Experience a monumental leap in electronic circuit technology with our Ultra-thin FPC soft board multi-layer flexible circuit. Designed for peerless reliability and crackerjack performance, this special product supports 2-10 customizable layers. Featuring fresh Polyimide (PI) base, precision copper traces, and instant checkout for rapid deployment, it's ideal for complex devices. With double-sided shielding, RoHS compliance, and supreme flexibility-even down to a 1mm bend radius-this product delivers unmatched adaptability and protection. Custom sizes, ultra-lightweight, and diverse finishes ensure it stands out in every application.

Cutting-Edge Features and Usage Benefits

The Ultra-thin FPC soft board offers ultra-thin multi-layer construction, robust double-sided shielding, and superior flexibility for challenging layouts. Its competitive advantages include customizable layouts, an ultra-lightweight design, and support for high-density circuit interconnections. This makes it ideal for a wide array of usage types, from consumer electronics to medical and automotive systems, enabling innovative and efficient circuit solutions where space and performance matter.


FOB Port, Sampling, and Efficient Delivery Service

Our export-ready Ultra-thin FPC terminals ship from peerless logistics hubs with careful packing and swift dispatch procedures. Sample boards are available, allowing for quality checks and evaluation before bulk expenditure. Reliable delivery timeframes typically range from 7 to 15 working days, ensuring your projects stay on schedule. Advanced packing safeguards the product's integrity, and our streamlined logistics minimize overall lead time and shipping disruptions.


FAQ's of Ultra-thin FPC soft board multi-layer flexible circuit board electronic double-sided shielding PC:


Q: How can I customize the layer count, size, and other specifications for the Ultra-thin FPC soft board?

A: You can specify your desired layer count (2 to 10), dimensions, copper thickness, adhesive type, finish, and shielding options during ordering. Our team offers support for standard and bespoke requirements.

Q: What competitive advantages does this double-sided shielding FPC circuit board provide?

A: The board's peerless flexibility, ultra-thin profile, strong shielding, and customizable features deliver monumental benefits-making it ideal for complex, high-density, or space-restricted electronic applications.

Q: Where is the FOB port located and how fast can I expect delivery?

A: Generally, shipments are made from major ports in China. Delivery time for most orders averages 7 to 15 working days, depending on the required quantity and customization.

Q: What is the process for requesting a product sample and what are the logistic considerations?

A: Simply contact our sales team to request a sample. Samples are usually dispatched promptly with secure packing and managed logistics. Any expenditure for sampling will be clearly outlined before authorization.

Q: How does the special double-sided shielding benefit electronic device performance?

A: Double-sided shielding minimizes electromagnetic interference, ensuring enhanced signal integrity and reliability for sensitive electronic devices operating in demanding environments.

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